Adhesive SiC ceramic sheet 10*10*3/5/10mm 10*15 ADSL heat sink |

Adhesive SiC ceramic sheet 10*10*3/5/10mm 10*15 ADSL heat sink |

Product effect: Heat radiation effect Through the understanding of the characteristics of the ceramic material itself without accumulating heat, the ceramic fins of the microporous structure were developed after continuous testing and research. The porosity can be increased by 30% in the same unit area, and the same surface area can be much larger than the surface area of ​​the dense surface material. 2. Thermal convection effect Due to the microporous structure, the surface area of ​​the ceramic heat sink is about 30% larger than that of the metal heat sink, and thus the convective medium air The larger contact area allows for more heat to be taken in the same unit time. 3. Use the characteristics of ceramic materials to achieve heat dissipation. Product Features: 1. The microporous ceramic has a small heat capacity, does not store heat itself, and directly dissipates heat. It does not form a “hot step” like a metal heat sink, which affects heat dissipation; 2. The structure of the micro-holes in the ceramic itself greatly increases the heat-dissipating area in contact with the air, greatly enhancing the heat-dissipating effect. Year-on-year conditions, in the natural convection state, the heat dissipation effect is better than super copper, aluminum; 3. Microporous ceramic itself is insulated, resistant to high temperature, oxidation, acid and alkali; 4. Microporous ceramic can withstand high current, can be high voltage, can prevent leakage breakdown, no noise, and will not generate coupling parasitic capacitance with power tubes such as MOS. Therefore, the filtering process is simplified; the required creepage distance is shorter than that required by the metal body, which further saves board space and is more conducive to the design of the engineer. And the passing of electrical certification; 5. Microporous ceramics can effectively prevent interference, anti-static effects, and absorb moisture and dust, without affecting its effect; 6. Microporous ceramic heat dissipation is more suitable for multi-directional heat dissipation IC packaging; 7. Microporous ceramics are small in size, light in weight, do not occupy space, save materials, save freight, and are more conducive to the rational layout of product design; 8. Microporous ceramics are inorganic materials and are more environmentally friendly; 9. Microporous ceramics are suitable for heat sources such as ICs, MOS, triodes, Schottky, IGBTs, etc. 10. It is especially suitable for low wattage power consumption. The design space is light, thin, short and small. Such as: ultra-thin LCD / LED LCD TV / LCD Display, LED-NB, pico projector, handheld MP4/MP5, ADSL modem, router, set-top box, etc.